Electronic devices with light sensors and displays

ABSTRACT

An electronic device is provided with a display and a light sensor that receives light that passes through the display. The display includes features that increase the amount of light that passes through the display. The features may be translucency enhancement features that allow light to pass directly through the display onto a light sensor mounted behind the display or may include a light-guiding layer that guides light through the display onto a light sensor mounted along an edge of the display. The translucency enhancement features may be formed in a reflector layer or an electrode layer for the display. The translucency enhancement features may include microperforations in a reflector layer of the display, a light-filtering reflector layer of the display, or a reflector layer of the display that passes a portion of the light and reflects an additional portion of the light.

This application is a continuation of U.S. patent application Ser. No.13/732,966, filed Jan. 2, 2013, which is hereby incorporated byreference herein in its entirety. This application claims the benefit ofand claims priority to U.S. patent application Ser. No. 13/732,966,filed Jan. 2, 2013.

BACKGROUND

This relates generally to electronic devices and, more particularly, toelectronic devices with displays and light sensors.

Electronic devices often include displays. For example, cellulartelephones and portable computers often include displays for presentinginformation to a user.

Electronic devices also often include light sensors. For example, anelectronic device may include an ambient light sensor that senses theamount of light in the environment surrounding the device. Thebrightness of display images generated by the display is sometimesadjusted based on the amount of ambient light. For example, in brightsunlight, the display brightness may be increased and in a dark room,the display brightness can be decreased.

In a typical device, the display emits display light from a first sideand has an opposing side that is opaque or reflective for preventinglight from leaking into the device. These opaque display structures alsoblock light that originates outside of the device such as ambient lightfrom passing through the display. Additional space is therefore commonlyprovided within a device enclosure to accommodate a light sensor thatreceives light through a transparent portion of the enclosure.

This type of additional space for a common display and light sensorpackage can result in an undesirable increase in the size and thicknessof the device.

It would therefore be desirable to be able to provide improved displaysfor electronic devices with light sensors and displays.

SUMMARY

An electronic device is provided with a display mounted in an electronicdevice housing. The electronic device is also provided with one or morelight sensors that receive light through at least a portion of thedisplay.

The light sensor may be implemented as an ambient light sensor, aproximity sensor, ultraviolet light sensor, infrared light sensor,thin-film solar cell, a photoplethysmograph, or other light sensor.

The display includes translucency enhancement features and/orlight-guiding features that allow light that originates outside thedevice to pass through the display onto the light sensor.

The display may be an organic light-emitting diode display, a liquidcrystal display or a display that incorporates other types of displaypixel technology.

The translucency enhancement features may include a translucentreflective layer that reflects display light generated by the displaywhile passing at least some ambient light, microperforations in one ormore display layers that allow ambient light to pass through the displaylayers, modified display traces that allow light to pass onto the lightsensor or other suitable translucency enhancement features that increasethe transparency of the display in comparison with conventionaldisplays.

The light-guiding features may include a light-guiding layer in thedisplay that guides light to a light sensor that is mounted along anedge of the light-guiding layer.

The light sensor can be mounted behind the display and configured toreceive light through the translucent display or the light sensor can bemounted along an edge of the display and receive light that is guided tothe light sensor by the light-guiding layer of the display.

Further features, their nature and various advantages will be moreapparent from the accompanying drawings and the following detaileddescription of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative electronic device suchas a laptop computer with a light sensor that receives light through adisplay in accordance with an embodiment.

FIG. 2 is a perspective view of an illustrative electronic device suchas a handheld electronic device with a light sensor that receives lightthrough a display in accordance with an embodiment.

FIG. 3 is a perspective view of an illustrative electronic device suchas a tablet computer with a light sensor that receives light through adisplay in accordance with an embodiment.

FIG. 4 is a perspective view of an illustrative electronic device suchas a computer display with a light sensor that receives light through adisplay in accordance with an embodiment.

FIG. 5 is a schematic diagram of an illustrative electronic device witha light sensor and a display in accordance with an embodiment.

FIG. 6 is a cross-sectional side view of a portion of an illustrativeelectronic device having a light sensor mounted behind an enhancedtranslucency display in accordance with an embodiment.

FIG. 7 is a cross-sectional side view of a portion of an illustrativeelectronic device having a light sensor mounted along an edge of adisplay that includes a light-guiding layer that guides light to thelight sensor in accordance with an embodiment.

FIG. 8 is a diagram of an illustrative top-emission organiclight-emitting diode display having translucency enhancement featuresthat allow light to pass through the display onto a light sensor inaccordance with an embodiment.

FIG. 9 is a diagram of an illustrative bottom-emission organiclight-emitting diode display having translucency enhancement featuresthat allow light to pass through the display onto a light sensor inaccordance with an embodiment.

FIG. 10 is a diagram of an illustrative liquid crystal display havingtranslucency enhancement features that allow light to pass through thedisplay onto a light sensor in accordance with an embodiment.

FIG. 11 is a diagram of an illustrative reflective display layer havingmicroperforations that enhance the translucency of the reflectivedisplay layer in accordance with an embodiment.

FIG. 12 is a diagram of an illustrative top-emission organiclight-emitting diode display having a light-guiding layer that guideslight onto a light sensor mounted along an edge of the display inaccordance with an embodiment.

FIG. 13 is a diagram of an illustrative bottom-emission organiclight-emitting diode display having a light-guiding layer that guideslight onto a light sensor mounted along an edge of the display inaccordance with an embodiment.

FIG. 14 is a diagram of an illustrative liquid crystal display having alight-guiding layer that guides light onto a light sensor mounted alongan edge of the display in accordance with an embodiment.

FIG. 15 is a top view of an illustrative light-guiding layer showing howthe light-guiding layer may guide light onto a light sensor mountedalong an edge of the light-guiding layer in accordance with anembodiment.

FIG. 16 is a top view of an illustrative display circuitry layer showinghow translucency enhancement features may include thinned conductivetraces on the display circuitry layer in accordance with an embodiment.

FIG. 17 is a top view of an illustrative display circuitry layer showinghow translucency enhancement features may include conductive traceshaving curved portions that deviate from a straight path to allow lightto pass through the conductive traces onto a light sensor in accordancewith an embodiment.

DETAILED DESCRIPTION

Electronic devices are provided with displays and light sensors. Thedisplay includes features that allow light to pass through the displayonto the one or more light sensors. The features that allow light topass through the display onto the one or more light sensors may includetranslucency enhancement features that enhance the translucency of thedisplay and/or light-guiding structures that guide light through thedisplay onto the light sensors. Illustrative electronic devices thathave displays and light sensors are shown in FIGS. 1, 2, 3, and 4.

Electronic device 10 of FIG. 1 has the shape of a laptop computer andhas upper housing 12A and lower housing 12B with components such askeyboard 16 and touchpad 18. Device 10 has hinge structures 20 to allowupper housing 12A to rotate in directions 22 about rotational axis 24relative to lower housing 12B. Display 14 such as an enhancedtranslucency display is mounted in upper housing 12A. Upper housing 12A,which may sometimes be referred to as a display housing or lid, isplaced in a closed position by rotating upper housing 12A towards lowerhousing 12B about rotational axis 24. Light sensors 40 such as ambientlight sensors are mounted behind a portion of display 14. Light sensors40 may be ambient light sensors, proximity sensors, ultraviolet lightsensors, infrared light sensors, thin-film solar cells,photoplethysmograph (PPG) sensors, or other light sensor that sense theamount of light falling on the light sensor through the translucentdisplay 14. Each light sensor 40 may include one or more photosensitiveelements such as one or more photodiodes that generate electricalsignals in response to incident light. Light sensors that areimplemented as proximity sensors may also include a light-emittingcomponent such as a light-emitting diode that emits light through atranslucency enhancement feature and/or a light-guiding layer of thedisplay.

FIG. 2 shows an illustrative configuration for electronic device 10 inwhich device 10 is implemented as a handheld device such as a cellulartelephone, music player, gaming device, navigation unit, or othercompact device. In this type of configuration for device 10, housing 12has opposing front and rear surfaces. Display 14 is mounted on a frontface of housing 12. Display 14 may have an exterior layer such as arigid transparent layer that includes openings for components such asbutton 26 and speaker port 28.

In the example of FIG. 3, electronic device 10 is a tablet computer. Inelectronic device 10 of FIG. 3, housing 12 has opposing planar front andrear surfaces. Display 14 is mounted on the front surface of housing 12.As shown in FIG. 3, display 14 has an external layer with an opening toaccommodate button 26.

FIG. 4 shows an illustrative configuration for electronic device 10 inwhich device 10 is a computer display or a computer that has beenintegrated into a computer display. With this type of arrangement,housing 12 for device 10 is mounted on a support structure such as stand27. Display 14 is mounted on a front face of housing 12.

In some configurations, peripheral portions of display 14 are providedwith a partially or completely opaque masking layer. As shown in FIGS.1, 2, 3, and 4, display 14 may be characterized by a central activeregion such as active region AA in which an array of display pixels isused in displaying information for a user. An inactive region such asinactive border region IA surrounds active region AA. In the examples ofFIGS. 1, 2, 3, and 4, active region AA has a rectangular shape. Inactiveregion IA has a rectangular ring shape that surrounds active region AA(as an example). Portions of display 14 in inactive region IA may becovered with a partially opaque masking material such as a layer ofblack ink (e.g., a polymer filled with carbon black) or a layer ofpartially opaque metal. The masking layer helps hide components in theinterior of device 10 in inactive region IA from view by a user.

In the examples of FIGS. 1, 2, 3, and 4, four light sensors 40 aremounted behind portions of display 14 in active area AA and fouradditional ambient light sensors 40 are mounted behind portions ofdisplay 14 in inactive area IA. However, this is merely illustrative. Ifdesired, device 10 may include more than four light sensors 40 in activearea AA, less than four light sensors 40 in active area AA, more thanfour light sensors 40 in inactive area IA, less than four light sensors40 in inactive area IA, a light sensor 40 that extends behindsubstantially all of active area AA, behind substantially all ofinactive area IA, or behind substantially all of active area AA andinactive area AA.

Light sensors 40 that are located in inactive area IA may be mountedalongside an edge of display 14. A light-guiding layer in display 14 mayguide light from outside of device 10 to the light sensor mounted alongthe edge of the display. In this way, a light sensor is provided thatcan be mounted separately from an outer transparent layer of a device(i.e., a light sensor can be formed in the interior of the device).However, this is merely illustrative. If desired, light sensors 40 maybe mounted directly behind display 14 in active area AA.

Display 14 includes translucency enhancement features that allow lightto pass through display 14 onto the light sensor 40 that is mounteddirectly behind the display.

The configurations for device 10 that are shown in FIGS. 1, 2, 3, and 4are merely illustrative. In general, electronic device 10 may be alaptop computer, a computer monitor containing an embedded computer, atablet computer, a cellular telephone, a media player, or other handheldor portable electronic device, a smaller device such as a wrist-watchdevice, a pendant device, a headphone or earpiece device, or otherwearable or miniature device, a television, a computer display that doesnot contain an embedded computer, a gaming device, a navigation device,an embedded system such as a system in which electronic equipment with adisplay is mounted in a kiosk or automobile, equipment that implementsthe functionality of two or more of these devices, or other electronicequipment.

Housing 12 of device 10, which is sometimes referred to as a case, isformed of materials such as plastic, glass, ceramics, carbon-fibercomposites and other fiber-based composites, metal (e.g., machinedaluminum, stainless steel, or other metals), other materials, or acombination of these materials. Device 10 may be formed using a unibodyconstruction in which most or all of housing 12 is formed from a singlestructural element (e.g., a piece of machined metal or a piece of moldedplastic) or may be formed from multiple housing structures (e.g., outerhousing structures that have been mounted to internal frame elements orother internal housing structures).

Display 14 may be a touch-sensitive display that includes a touch sensoror may be insensitive to touch. Touch sensors for display 14 may beformed from an array of capacitive touch sensor electrodes, a resistivetouch array, touch sensor structures based on acoustic touch, opticaltouch, or force-based touch technologies, or other suitable touch sensorcomponents.

Displays for device 10 may, in general, include image pixels formed fromlight-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells,electrowetting pixels, electrophoretic pixels, liquid crystal display(LCD) components, or other suitable image pixel structures. In somesituations, it may be desirable to use OLED components to form display14, so configurations for display 14 in which display 14 is an organiclight-emitting diode display are sometimes described herein as anexample. Other types of display technology may be used in device 10, ifdesired.

A schematic diagram of device 10 is shown in FIG. 5. As shown in FIG. 5,electronic device 10 includes control circuitry such as storage andprocessing circuitry 400. Storage and processing circuitry 400 includesone or more different types of storage such as hard disk drive storage,nonvolatile memory (e.g., flash memory or otherelectrically-programmable-read-only memory), volatile memory (e.g.,static or dynamic random-access-memory), etc. Processing circuitry instorage and processing circuitry 400 is used in controlling theoperation of device 10. The processing circuitry may be based on aprocessor such as a microprocessor and other integrated circuits.

With one suitable arrangement, storage and processing circuitry 400 isused to run software on device 10 such as internet browsingapplications, email applications, media playback applications, operatingsystem functions, software for capturing and processing images, softwarefor implementing functions associated with gathering and processingsensor data, etc.

Input-output circuitry 32 is used to allow data to be supplied to device10 and to allow data to be provided from device 10 to external devices.

Input-output circuitry 32 can include wired and wireless communicationscircuitry 34. Communications circuitry 34 may include radio-frequency(RF) transceiver circuitry formed from one or more integrated circuits,power amplifier circuitry, low-noise input amplifiers, passive RFcomponents, one or more antennas, and other circuitry for handling RFwireless signals. Wireless signals can also be sent using light (e.g.,using infrared communications).

Input-output circuitry 32 of FIG. 5 includes input-output devices 36such as buttons, joysticks, click wheels, scrolling wheels, a touchscreen such as translucent display 14, other touch sensors such as trackpads or touch-sensor-based buttons, vibrators, audio components such asmicrophones and speakers, image capture devices such as a camera modulehaving an image sensor and a corresponding lens system, keyboards,status-indicator lights, tone generators, key pads, and other equipmentfor gathering input from a user or other external source and/orgenerating output for a user.

Sensors 38 of FIG. 5 include a light sensor such as an ambient lightsensor for gathering information on ambient light levels. Sensors 38also include other light sensor components such as proximity sensorcomponents. Proximity sensor components in device 10 can includecapacitive proximity sensor components, infrared-light-based proximitysensor components, proximity sensor components based on acousticsignaling schemes, solar cell light sensor technology, or otherproximity sensor equipment. Sensors 38 may also include a pressuresensor, a temperature sensor, an accelerometer, a gyroscope, and othercircuitry for making measurements of the environment surrounding device10.

It can be challenging to mount electrical components such as thecomponents of FIG. 5 within an electronic device. To facilitate mountingof components in housing 12 of device 10, sensors 38 may be configuredto receive light through a portion of a display having translucencyenhancement features and/or light-guiding features that increase theamount of light that passes through the display onto the light sensor.

Storage and processing circuitry 400 samples voltages, electricalcharges, or other electrical light sensor signals from light sensors 40of sensors 38. Storage and processing circuitry 400 converts the sampledsignals into ambient light intensities. Storage and processing circuitry400 controls other aspects of the operation of device 10 using theconverted ambient light intensities. For example, storage and processingcircuitry can increase or decrease the display light from the devicedisplay based on the ambient light intensity.

FIG. 6 is a cross-sectional view of a portion of device 10 with a lightsensor such as light sensor 40 that is mounted adjacent to inner surface77 of display 14 having translucency enhancement features 43. Device 10also includes a circuitry such as printed circuit board 42 and aflexible printed circuit 44 that electrically couples light sensor 40 toprinted circuit board (PCB) 42. Circuitry associated with printedcircuit board 42 (e.g., internal circuitry, circuitry on a surface ofPCB 42, and/or integrated circuitry such as circuit components 48mounted to a surface of PCB 42) controls the operation of display 14 andlight sensor 40. PCB 42 and components 48 may, for example, form some orall of storage and processing circuitry 400 of FIG. 5.

Light signals such as ambient light intensity signals gathered usinglight sensor 40 in response to light 45 are routed to printed circuitboard 42 through flexible printed circuit 44. Flexible printed circuit44 is attached to a portion of sensor 40 using electrical couplingmaterial (e.g., anisotropic conductive film (ACF), solder, or otherelectrically conductive adhesive material). An opposing end of flexibleprinted circuit 44 is attached to a portion of PCB 42 using electricalcoupling material (e.g., anisotropic conductive film (ACF), solder, orother electrically conductive adhesive materials, or mechanicalconnector structures).

Display 14 may include multiple display layers such as layers 14A and14B. Display layer 14B may include a transparent cover layer (e.g., asheet of transparent plastic or glass) and, if desired, atouch-sensitive layer and/or other display layers such as protectivefilms, anti-reflection coatings, anti-glare coatings, anti-smudgecoatings, etc. A touch-sensitive layer may include transparentelectrodes formed from, for example, indium tin oxide or othertransparent or translucent conductive material. Touch-sensor circuitrymay include capacitive touch-sensor technology, resistive touch-sensortechnology, force-based touch-sensor technology or other touch-sensortechnology for gathering user touch input.

Display layer 14A may include multiple layers for generating displayimages for display 14. Display layer 14A may include image generatingstructures such as light-emitting diodes (LEDs), organic LEDs (OLEDs),plasma cells, electrowetting pixels, electrophoretic pixels, liquidcrystal display (LCD) components, backlight structures, or othersuitable image pixel structures.

As shown in FIG. 6, translucency enhancement features 43 may be featuresof display 14 that allow light 45 from outside of device 10 to betransmitted directly through display 14 onto light sensor 40.Translucency enhancement features of this type may allow less than 1percent, less than 0.5 percent, less than 0.2 percent, less than 0.05percent, less than 0.02 percent, greater than 0.01 percent, greater than0.02 percent, greater than 0.1 percent between 0.05 and 1 percent,between 0.05 percent and 3 percent or less than 5 percent of light 45 topass through features 43.

Translucency enhancement features 43 may include openings in a displaylayer (e.g., microperforations in a reflective layer of a display), apartially transmissive reflector layer (e.g., a reflective layer thatreflects a portion of the light that is incident on it while passing arelatively smaller portion of the incident light or a reflective layerthat reflects light such as display light 50 having a first set ofwavelengths such as visible wavelengths while passing light of a second,different set of wavelengths such as infrared and/or ultravioletwavelengths), or other structures that allow a relatively larger portionof incident light to pass through as compared with conventionaldisplays.

Translucency enhancement features 43 may be formed in localized portionsof display 14 as in the example of FIG. 6 or may extend across some orall of display 14. In configurations in which features 43 are formed inlocalized portions of display 14, a larger fraction of ambient light 45may pass through features 43 than the fraction that passes through otherportions of display 14. In configurations in which features 43 extendacross substantially all of display 14, display 14 may be a translucentdisplay that allows a measurable fraction of external light 45 to passthrough the display onto a sensor such as sensor 40.

The translucency enhancement features of FIG. 6 are merely illustrative.As shown in FIG. 7, display 14 may be provided with one or morelight-guiding structures such as light-guiding layer 52 of display 14that guide light through at least a portion of the display to a lightsensor such as light sensor 40. In the example of FIG. 7, light sensor40 is mounted adjacent to edge 120 of display layers 14A. In this typeof configuration, light 45 enters display 14 through outer surface 56and is redirected along layer 52 onto sensor 40. Light-guiding layer 52may include wave-guide structures, light-focusing structures, opticalfilms such as wave-guide films or film stacks that redirect light basedon reflections at refractive index changes between films in the stack,beam steering films, geometric light-guiding structures, corrugatedlight-guiding structures, or other light-guiding structures.

As examples, layer 52 may include a first planar layer of transparentmaterial and a curved layer of transparent material attached to theplanar layer that guides light in a direction parallel to the planarlayer or layer 52 may include a pair of transparent layers having planarouter surfaces and interfacing corrugated interior surfaces that guidelight in a direction parallel to the planar outer surfaces usingreflections at the interfacing corrugated interior surfaces.

FIGS. 8, 9, 10, and 11 show examples of arrangements in which display 14includes translucency enhancement features that allow light from outsideof device 10 to be transmitted directly through display 14 onto a lightsensor. FIGS. 12, 13, and 14 show examples of arrangements in whichdisplay 14 includes a light-guiding layer that guides light through thedisplay to a light sensor that mounted adjacent the display.

FIG. 8 is a cross-sectional view of a light sensor 40 that that receiveslight 45 through display layers 14A that are implemented as atop-emission organic light emitting diode (OLED) display. FIG. 9 is across-sectional view of a light sensor 40 that that receives light 45through display layers 14A that are implemented as a bottom-emissionorganic light emitting diode (OLED) display. FIG. 10 is across-sectional view of a light sensor 40 that that receives light 45through display layers 14A that are implemented as a liquid crystaldisplay (LCD).

In a configuration for display 14 of the type shown in FIG. 8, layers14A include an outer layer such as layer 60. Outer layer 60 may includea protective film and/or one or more light-polarizing layers such as alinear polarizer and/or a circular polarizer. Layers 14A include a layerof organic light-emitting material such as organic emissive layer 66that is interposed between electrode layers 64 and 68. Electrode layer64 may be a partially transmissive electrode layer such as a cathodelayer that allows display light 50 to pass through the electrodes.

Organic emissive layer 66 may be formed from organic plastics such aspolyfluorene or other organic emissive materials. Electrode layer 64 iscovered by barrier layer 62. Barrier layer 62 may be formed from a layerof plastic, a glass layer, a thin-film encapsulation layer formed from amaterial such as silicon nitride, a layered stack of alternating polymerand ceramic materials, or other suitable material for forming a barrierlayer that protects organic emissive layer 66 from environmentalexposure by preventing water and oxygen from reaching organic emissivematerials within layer 66.

Electrode layer 68 may be a reflective or partially reflective electrodelayer such an anode layer. An array of thin-film transistors (TFTs) maybe formed throughout some or all of layer 68. The thin-film transistorsmay be formed from semiconductors such as amorphous silicon,polysilicon, or compound semiconductors (as examples). Layer 68 mayinclude reflective material or opaque masking material (e.g., black ink)on thin film-transistors in layer 68 that helps prevent the thin-filmtransistors from being viewed by a viewer such as viewer 80 viewingdisplay 14 in direction 82. If desired, a layer of transparentdielectric material such as dielectric layer 70 may be formed on asurface of electrode layer 68. Dielectric layer 70 may help planarizethe surface of electrode layer 68 or may be a dielectric spacer layerfor display 14. However, this is merely illustrative. If desired,display layer 14A may be formed without dielectric layer 70.

An additional barrier layer such as barrier layer 72 is formed overelectrode layer 68 and dielectric layer 70. In configurations in whichlayers 14A are provided without dielectric layer 70, barrier layer 72may be formed directly on electrode layer 68. Barrier layer 72 may beformed from a layer of metal foil, metal foil covered with plastic,other metal structures, a glass layer, a thin-film encapsulation layerformed from a material such as silicon nitride, a layered stack ofalternating polymer and ceramic materials, or other suitable materialfor encapsulating organic emissive layer 66 and electrode layer 68.

Substrate layer 74 (e.g., a layer of plastic or glass) is attached tobarrier layer 72. A reflective layer such as reflector 76 may beattached to substrate 74. Reflective layer 76 reflects light that isemitted from organic emissive layer 66 in the direction of reflector 76back out of display layers 14A to be viewed by a viewer such as viewer80.

As shown in FIG. 8, one or more light sensors 40 may be mounted adjacentto a surface such as surface 77 of reflector 76. Light 45 such asambient light passes through translucency enhancement features 43 indisplay layer 14A onto light sensors 40. In the example of FIG. 8,translucency enhancement features 43 are formed in reflector layer 76and electrode/TFT layer 68. However, this is merely illustrative. Ifdesired, display 14 may include translucency enhancement features in anylocation in display 14.

Translucency enhancement features 43 in reflector layer 76 may includeopenings such as microperforations (i.e., perforations that allow lightto pass through but that are too small to be seen with the human eyewhen no light shines through the perforations) or regions of modifiedtransparency in reflector layer 76. For example, translucencyenhancement features 43 may be portions of reflector 76 that are formedform translucent material that reflects a portion of the light that isincident on it while passing a relatively smaller portion of theincident light or features 43 may be portions of reflector 76 that areformed from a material that reflects light such as display light 50having a first set of wavelengths such as visible wavelengths whilepassing light of a second, different set of wavelengths such as infraredand/or ultraviolet wavelengths (as examples).

Translucency enhancement features 43 may be formed in localized portionsof reflector 76 as in the example of FIG. 8 or may extend across some orall of reflector 76 (e.g., reflector 76 may be substantially all formedfrom a material that is partially translucent or that allows lighthaving a given range of wavelengths such as infrared wavelengths and/orultraviolet wavelengths to pass while reflecting light of otherwavelengths).

Translucency enhancement features in electrode/TFT layer 68 may includemicroperforations in layer 68, portions of layer 68 that are formed froma translucent material, portions of layer 68 that are formed from amaterial that passes light having a given range of wavelengths (e.g.,infrared wavelengths and/or ultraviolet wavelengths) while reflectinglight of other wavelengths, or may include portions of opaque conductivestructures such as conductive traces that are modified to allow light topass through or between the conductive traces. Modified conductivetraces may include locally thinned conductive traces or reroutedconductive traces (as examples). As shown in FIG. 8, features 43 inlayer 68 may be aligned with features 43 in layer 76 so that light suchas light 45 may pass through the aligned translucency enhancementfeatures in multiple display layers onto one or more of light sensors40.

Light absorbing material 78 is formed on surface 77 of reflector 76.Light absorbing material may include light-absorbing ink such asinfrared absorbing ink that prevents light from reflecting from sensors40 back through display layers 14A. Material 78 on surface 77 helpsprevent user 80 from viewing light sensor 40. Material 78 may includeone or more openings 79 aligned with features 43 that allow light topass through the openings onto sensors 40.

In a configuration for display 14 of the type shown in FIG. 9, lightsensors 40 receive light 45 through translucency enhancement features 43in a bottom-emission light emitting diode display (i.e., an OLED displaythat emits light through a substrate layer). In the example of FIG. 9, afirst surface of substrate layer 74 is attached to outer layer 60 and asecond, opposing surface of substrate 74 is attached to barrier layer72. Optional dielectric layer 70 is attached to barrier layer 72 andelectrode layer 64 is attached to dielectric layer 70. In configurationsin which display layers 14A are provided without dielectric layer 70,barrier layer 72 may be formed directly on electrode layer 64. Organicemissive layer 66 is sandwiched between electrode layers 64 and 68 andemits display light 50 through electrode layer 64 and other displaylayers 14A. Barrier layer 62 is formed on electrode layer 68 andreflector layer 76 is attached to barrier layer 62.

One or more light sensors 40 is mounted adjacent to surface 77 ofreflector 76 and receives light such as light 45 through translucencyenhancement features 43 in reflector layer 76, electrode layer 68,and/or other layers of display layers 14A.

In a configuration for display 14 of the type shown in FIG. 10, lightsensors 40 receive light 45 through translucency enhancement features 43in a liquid crystal display (LCD) formed from liquid crystal displaycell 84 and backlight structures 86. Liquid crystal layer 92 of LCD cell84 is formed between color filter layer 90 and thin-film transistorlayer 94. Layers 90 and 94 may be formed on a transparent substrate suchas a sheet of glass. Liquid crystal layer 92, color filter layer 90, andthin-film transistor layer 94 are sandwiched between light polarizinglayers such as upper polarizer 88 and lower polarizer 96.

Backlight structures 86 may include a light guide plate such as lightguide plate 100. Light guide plate 100 may be formed from a transparentmaterial such as clear glass or plastic that guides light using internalreflections within plate 100. During operation of backlight structures86, a light source such as light source 102 may generate light 103.Light source 102 may be, for example, an array of light-emitting diodes.

Light 103 from light source 102 may be coupled into an edge of lightguide plate 100 and may be distributed in dimensions X and Y throughoutlight guide plate 100 due to the principal of total internal reflection.Light guide plate 100 may include light-scattering features such as pitsor bumps. The light-scattering features may be located on an uppersurface and/or on an opposing lower surface of light guide plate 100.

Light 103 that scatters upwards in direction Z from light guide plate100 may serve as display light 50 for display 14. Light 103 thatscatters downwards may be reflected back in the upwards direction byreflector 76. Reflector 76 may be formed from a reflective material suchas metal, a layer of white plastic or may be formed from a translucentmaterial that allows some of light 45 to pass while reflecting otherportions of light 45.

Backlight structures 86 may include optical films (e.g., diffuserlayers, compensation films for enhancing off-axis viewing, andbrightness enhancement films (also sometimes referred to as turningfilms) for collimating backlight).

Light sensor 40 may be attached to interior surface 77 of a reflectorsuch as reflector 76 that is implemented in backlight unit 86 and mayreceive ambient light through upper polarizer 88, color filter layer 90,liquid crystal layer 92, thin-film transistor layer 94, lower polarizerlayer 96, and backlight unit 86. Backlight unit 86, thin-film transistorlayer 94 and/or other portions of a liquid crystal display of the typeshown in FIG. 10 may include features 43 that enhance the transmissionof light 45 through display layers 14A to sensor 40.

As described above in connection with FIG. 8, translucency enhancementfeatures 43 in reflector layer 76 may include openings such asmicroperforations (i.e., perforations that allow light to pass throughbut that are too small to be seen with the human eye when light does notshine through the perforations) or regions of modified transparency inreflector layer 76.

Translucency enhancement features 43 may be formed in localized portionsof reflector 76 or may extend across some or all of reflector 76.

Translucency enhancement features 43 in thin-film transistor layer 94may include microperforations in layer 94, partially translucentportions of layer 94, portions of layer 94 that pass light having agiven range of wavelengths (e.g., infrared and/or ultravioletwavelengths) while reflecting light of other wavelengths (e.g., visiblewavelengths), or may include portions of opaque conductive structuressuch as conductive traces that are modified to allow light to passthrough the conductive traces. Modified conductive traces may includelocally thinned conductive traces or rerouted conductive traces (asexamples). Features 43 in layer 94 may be aligned with features 43 inlayer 76 so that light such as light 45 may pass through the alignedtranslucency enhancement features onto one or more of light sensors 40.

FIG. 11 is cross-sectional view of a portion of reflector 76 showing howtranslucency enhancement features 43 may be formed from openings such asmicroperforations 104 in reflector 76. Microperforations 104 passthrough reflector 76 from a first surface to an opposing second surfaceof reflector 76. Openings 104 may include openings in masking material78. Microperforations 104 may be laser-drilled openings in layer 76 (asan example). If desired, microperforations such as microperforations 104may be formed in other layers of display 14 (e.g., one or moreadditional display layers of display layers 14A and/or one or more ofdisplay layers 14B). Microperforations 104 may be formed in a localizedportion of reflector 76 or may be formed across substantially all ofreflector 76.

FIG. 12 is a cross-sectional view of a light sensor 40 that thatreceives light 45 through a light-guiding layer of display layers 14Athat are implemented as a top-emission OLED display. FIG. 13 is across-sectional view of a light sensor 40 that that receives light 45through a light-guiding layer of display layers 14A that are implementedas a bottom-emission OLED display. FIG. 14 is a cross-sectional view ofa light sensor 40 that that receives light 45 through a light-guidinglayer of display layers 14A that are implemented as an LCD display.

In a configuration for display 14 of the type shown in FIG. 12, atop-emission OLED display of the type shown in FIG. 8 is provided withan additional layer such as light-guide layer 52. Light-guide layer 52is attached to barrier layer 72 using a layer of transparent adhesivesuch as optically clear adhesive layer 108. Substrate 74 is attached toan opposing surface of light-guide layer 52 and to reflective layer 76.Light 45 that passes through organic emissive layer 66 and enterslight-guide layer 52 is guided within layer 52 (e.g., along the x-yplane of FIG. 12) onto a light sensor 40 that is mounted adjacent toedge 120 of display layers 14A (e.g., adjacent to an edge of light-guidelayer 52).

During manufacturing and assembly operations, a temporary substrate suchas a plastic sheet may be attached to display layers 14A at location124. After assembly of display layers 60, 62, 64, 66, 68, 70, and 72 onthe temporary substrate, the temporary substrate may be removed andlight-guide layer 52 may be attached at location 124 using adhesive 108.

In a configuration for display 14 of the type shown in FIG. 13, abottom-emission OLED display of the type shown in FIG. 9 is providedwith an additional layer such as light-guide layer 52. Light-guide layer52 is attached to barrier layer 72 using a layer of transparent adhesivesuch as optically clear adhesive layer 108. Substrate 74 is attached toan opposing surface of light-guide layer 52 and to outer layer 60. Light45 that enters light-guide layer 52 is guided within layer 52 (along thex-y plane of FIG. 13) onto a light sensor 40 that is mounted adjacent toedge 120 of display layers 14A (e.g., adjacent to an edge of light-guidelayer 52). Display light 50 passes through light-guide layer 52 and outof display layers 14A to be viewed by viewer 80 in direction 82.

In a configuration for display 14 of the type shown in FIG. 14, an LCDdisplay of the type shown in FIG. 10 is provided with an additionallayer such as light-guide layer 52. Light-guide layer 52 is interposedbetween LCD cell 84 and backlight structures 86. However, this is merelyillustrative. If desired, light-guide layer 52 may be formed behindbacklight unit 86 or may be formed between two other layers of LCD cell84 or backlight structures 86. In the example of FIG. 14, light 45 thatenters light-guide layer 52 after passing through LCD cell 84 is guidedwithin layer 52 (e.g., along the x-y plane of FIG. 14) onto a lightsensor 40 that is mounted adjacent to edge 120 of display layers 14A(e.g., adjacent to an edge of light-guide layer 52). Display light 50that is generated by backlight structures 86 passes through light-guidelayer 52, through LCD cell 84, and out of display layers 14A to beviewed by viewer 80 in direction 82.

In the examples of FIGS. 12, 13, and 14, device 10 includes a lightsensor mounted along edge 120 of display 14 that receives light throughlight-guide layer 52, and two light sensors mounted adjacent to interiorsurface 77 of display 14 that receive light through translucencyenhancement features 43. However this is merely illustrative. In variousother possible combinations, device 10 may be provided with a singlelight sensor mounted adjacent to surface 77, three or more light sensorsmounted adjacent to surface 77 or no light sensors mounted adjacent tosurface 77. Device 10 may include more than one light sensor mountedadjacent to edge 120 or may be provided without any light sensorsmounted adjacent to edge 120.

In order to minimize the effect of display light 50 on light detectionoperations using light sensors 40, the light sensors may be providedwith light-filtering structures such as light-filtering films thatprevent display light from reaching the sensors, light sensor data maybe gathered during blanking periods in which display 14 is notgenerating display light, or display light signals may be removed fromlight sensor data using software applications that access stored displaylight data associated with known features of the display light (e.g.,known display light wavelengths, known display light intensities orknown display light emission cycles).

FIG. 15 is a top view of a light guide layer such as light-guide layer52 (e.g., light-guide layer 52 of any of FIG. 7, 12, 13, or 14). In theexample of FIG. 15, light-guide layer 52 includes internal light guidingstructures 128 (e.g., geometric features, corrugated features, etc.)that guide light that is incident on light-guide layer 52 alongdirections 130 onto light sensor 40 mounted along edge 120. Light-guidelayer 52 may include a coating layer 125 on edge 120 that prevents lightfrom exiting light-guide layer 52. Coating 125 may have an opening suchas opening 126 that allows light to exit from edge 120 through opening126 onto light sensor 40.

FIG. 16 is a top view of a portion of a display circuitry layer havingtranslucency enhancement features formed from modified conductive traceson the circuitry layer. Display circuitry layer 110 may be a portion ofelectrode/TFT layer 68 of any of FIG. 8, 9, 12, or 13, may be a portionof TFT layer 94 of either of FIG. 10 or 14, or may be any other layer ofdisplay 14 having conductive traces such as traces 112. Conductivetraces 112 may be formed from opaque conductive material such as metal(e.g., copper).

In the example of FIG. 16, translucency enhancement features 43 areformed from thinned portions 114 of selected conductive traces 112.Thinned portions 114 are formed over light sensor 40 so that light maypass between thinned portions 114 onto sensor 40. Layer 110 includesconductive traces 112 having thinned portions 114 and conductive traces112 that have a substantially constant thickness along the length of thetrace.

The modified conductive traces of FIG. 16 are merely illustrative. Ifdesired, conductive traces on layer 110 may be modified in other ways toallow light to pass through conductive traces 112 onto light sensor 40.

In the example of FIG. 17, traces 112 include curved portions 116 thatreroute the traces on layer 110 so that the traces avoid overlappinglight sensor 40. In this way, curved portions 116 of layer 110 allowlight to pass between curved portions 116 of traces 112 onto lightsensor 40. Layer 110 includes conductive traces 112 having curvedportions 116 and conductive traces 112 that extend along substantiallystraight paths on layer 110.

The foregoing is merely illustrative and various modifications can bemade by those skilled in the art without departing from the scope andspirit of the described embodiments. The foregoing embodiments may beimplemented individually or in any combination.

What is claimed is:
 1. An electronic device having a display and a lightsensor mounted beneath the display, the display comprising: a substrate;a first electrode layer formed on the substrate; a layer of organicemissive material formed on the first electrode layer; a secondelectrode layer formed on the layer of organic emissive material suchthat the layer of organic emissive material is interposed between thefirst and second electrode layers, wherein the second electrode layercomprises conductive traces having modified portions that are alignedwith the light sensor to allow for light to pass through the secondelectrode layer onto the light sensor; and a layer of light absorbingmaterial interposed between the first electrode layer and the lightsensor, wherein the layer of light absorbing material comprises openingsthat are aligned with the modified portions of the conductive tracessuch that the light passes through the openings and between the modifiedportions of the conductive traces onto the light sensor.
 2. Theelectronic device defined in claim 1, wherein the second electrode layercomprises an array of thin-film transistors.
 3. The electronic devicedefined in claim 2, wherein the modified portions of the conductivetraces comprise thinned portions over the light sensor, wherein thelight passes between the thinned portions onto the light sensor.
 4. Theelectronic device defined in claim 2, wherein the modified portions ofthe conductive traces comprise curved portions, wherein the light passesbetween the curved portions onto the light sensor.
 5. The electronicdevice defined in claim 4, wherein the curved portions do not overlapthe light sensor.
 6. The electronic device defined in claim 1, whereinthe first electrode layer comprises a cathode layer.
 7. The electronicdevice defined in claim 6, wherein the second electrode layer comprisesan anode layer.
 8. The electronic device defined in claim 1, wherein thesubstrate is interposed between the layer of organic emissive materialand the light sensor.
 9. The electronic device defined in claim 1,wherein the layer of organic emissive material is interposed between thesubstrate and the light sensor.
 10. An organic light-emitting diodedisplay comprising: a cathode layer; an electrode layer comprising anarray of thin-film transistors, an anode layer, and conductive traces; alayer of organic emissive material interposed between the cathode layerand the anode layer, wherein the layer of organic emissive materialemits light through the cathode layer to display images on the display;and a layer of masking material interposed between the cathode layer anda light sensor mounted beneath the organic light-emitting diode display,wherein the conductive traces in the electrode layer comprise modifiedportions that are aligned with the light sensor, wherein the layer ofmasking material comprises openings that are aligned with the lightsensor, and wherein the light sensor receives light through the modifiedportions and the openings.
 11. The organic light-emitting diode displaydefined in claim 10, wherein the conductive traces have a constantthickness and wherein the modified portions are thinned portions thatare thinned relative to the constant thickness.
 12. The organiclight-emitting diode display defined in claim 11, wherein spacingbetween the thinned portions is increased relative to the spacingbetween portions of the conductive traces having the constant thickness.13. The organic light-emitting diode display defined in claim 12,wherein the thinned portions overlap the light sensor and the openingsin the layer of masking material.
 14. The organic light-emitting diodedisplay defined in claim 10, wherein the conductive traces extend alongstraight paths and wherein the modified portions are curved portionsthat curve away from the straight paths.
 15. The organic light-emittingdiode display defined in claim 14, wherein the curved portions do notoverlap the light sensor.
 16. The organic light-emitting diode displaydefined in claim 10, wherein the light received by the light sensorcomprises ambient light.
 17. An electronic device, comprising: a lightsensor; and a display formed over the light sensor, the displaycomprising: a substrate layer, a first electrode layer; a secondelectrode layer comprising at least one thin-film transistor and atleast one feature configured to allow light from outside the display topass through the display and reach the light sensor; a layer of organicemissive material interposed between the first and second electrodelayers; and a layer of light blocking material interposed between thefirst electrode layer and the light sensor, wherein the layer of lightblocking material comprises an opening that is aligned with the at leastone feature in the second electrode layer and the light sensor such thatthe light from outside the display passes through the at least onefeature and the opening to reach the light sensor.
 18. The electronicdevice defined in claim 17, wherein the first electrode layer comprisesa cathode, wherein the second electrode layer further comprises an anodeand a plurality of conductive traces, and wherein the at least onefeature comprises a modified portion of at least one of the plurality ofconductive traces.
 19. The electronic device defined in claim 17,wherein the display further comprises: a polarizer, wherein the layer oforganic emissive material is interposed between the polarizer and thesubstrate; a first barrier layer interposed between the substrate andthe second electrode layer; and a second barrier layer interposedbetween the first electrode layer and the polarizer.
 20. The electronicdevice defined in claim 17, wherein the display further comprises: apolarizer, wherein the substrate is interposed between the polarizer andthe layer of organic emissive material; a first barrier layer interposedbetween the substrate and the first electrode layer; and a secondbarrier layer interposed between the layer of light-blocking materialand the second electrode layer.